Servicing Arizona and New Mexico for the RTI product line.
Robson Technologies, Inc.
Results Through Innovation   /  Intelligent Solutions by Design


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TEST SOCKETS     DUT BOARDS    TEST FIXTURES    INTEFACE SOLUTIONS   
SWITCH BOXES & A/B RELAY BOXES    OTHER PRODUCTS   

RTI specializes in providing custom and standard solutions for LSI and hybrid testing requirements for failure analysis, package development, prototype engineering, wafer sort and final test. We not only think out of the box, but in most cases don’t consider the existence of a box. We have been providing Results Through Innovation for testing requirements for over 15 years. RTI designs and manufactures a large variety of sockets to test integrated circuits and hybrids. The company focuses on providing solutions for unique package types in addition to many standard packages including CSP, LLP, QFN and BGA. RTI has designed and manufactured sockets for 0.3, 0.5, 0.8, 1.0, 1.27mm and larger pitch packages with pin counts ranging from 3 to 1,400 pins.

CLICK HERE to download the RTI Products Overview document (1.6 MEG PDF FILE).
TEST SOCKETS    BACK TO THE TOP
  • Strip testing of CSP and LLP packages
  • Kelvin testing (Two probes per pkg. pins)
  • CCD (optical) packaged devices
  • Optical Interface Packages
  • In-vitro Devices
  • Hearing Aids
  • Implantable medical hybrids
  • RF Modules and devices over 10Ghz
  • Multi-chip modules
  • Silicon-on-Silicon
  • Packages with test pads on both top & bottom
  • Packages mounted on 35mm flex circuits
  • Hybrids with components on both sides
  • Sockets with heat sinks and other mechanical obstructions
  • Sockets with internal filter caps or other passive or active SMT devices
    • TEST SOCKETS
    Product Photo Gallery
    RAPID RESPONSE TEST SOCKETS. This series of pogo pin sockets are designed to meet most low pin count failure analysis or engineering requirements including bench test, liquid crystal analysis, ESD testing, photoemission, back-side emission, micro probing, characterization, and low volume engineering /product test applications. This series of sockets are available with 7 day delivery.
    Click here to download the product brochure [1 meg PDF file].

    RF interposer sockets with 20GHz performance. These are great for engineering characterization. For production use, the compliance is only .003 inches, so the handler must be set up for this. Do not confuse these sockets with the "elastomer" sockets. It is a completely new patented technology. Characterization data is avalable. Another advantage is that the customer can design the DUT board to be compatible with both our 1133 series pogo pin sockets (with RF pins) and the 1143 interposer sockets.
    Click here to download the product brochure [1 meg PDF file].

    Test socket for a silicon-on-flex circuit with test pads on 0.5mm centers. The socket was designed incorporating a multi-layer PCB through-hole adaptor with active electronics and a mating socket receptacle.
    Test socket for a CMOS imaging device in a ceramic package with a glass top. The device was required to be tested “dead bug” or pads-side up. The socket lid contains a PCB to route the interconnect to additional pogo pins which then contact to the socket base. The socket base is through-hole with a mating receptacle.
    A 28 pin QFN test socket for failure analysis micro probing and back side test (notice hole in center of socket base).
    16 + 8 ground 0.5mm pitch QFN production socket using high force pins to test lead-free packages.
    Dual site 14 lead 0.5mm pitch LCC socket for strip testing. RTI has designed many versions of this socket for various pin counts .
    RTI / Plastronics FA socket with low-profile lid for micro probing. These sockets are available for up to 96 leads. RTI is also a distributor of Plastronics standard QFN burn-in sockets.
    Socket with adjustable dual latch clam shell lid for high pin count BGA packages.
    Bottom side of a 40 + 64 ground 0.5mm pitch RF socket showing pockets for components that can be placed less than one mm from the test pins. The pins are very short and low inductance (RTI L4-311 pin).
    1024 BGA 1.0mm pitch universal socket with an adjustable lid and alignment plates for devices from 10mm to 35mm square. These sockets are available for 0.5, 0.8, 1.0 and 1.27mm pitch. Other pin counts and sizes are also available.
    12 pin RF socket with a gold-plated copper heat sink for the ground connection to the DUT board. This socket was designed for a high powered RF amplifier which required the socket to dissipate heat as well as provide an excellent electrical ground.
    This BGA socket is for a very fine pitch silicon die with 128 balls on 0.20mm pitch.
    28 pad engineering / production test socket for a PCB hybrid.
    48 pin LQFP 0.5mm pitch production test socket incorporating a floating base and high force pins for lead-free packages.
    32 +16 ground LCC 0.5mm pitch RF socket with RTI's L4-311 low inductance pins. Pockets are provided under the socket for placing components next to the test pins.
    Custom socket and fixture for testing a ceramic hybrid module and flex circuit for a space satellite. Test points on the ceramic were randomly placed on a pitch as small as 0.5mm. RTI provided the test sockets and fixtures for testing the completed module as well as the ceramic substrate before assembly.
    Test socket for a silicon-on-silicon multi-chip module BGA with 278 balls on a 1.0mm pitch.
    Our largest open-top socket with a clam shell lid we have made to date. This thorugh-hole pogo pin socket was designed to test a ceramic hybrid containing optical devices. The ceramic substrate is approximately 10 inches long and one inch wide. An insert is provided to compensate for two different thicknesses of ceramic.
    High Current Kelvin socket with an internal PCB containing filter capacitors and an RF monitoring point. The high current probes are rated for 20 amp with 3 amp Kelvin probes on three of the test points. The socket is designed for use with a dual latch lid.
    Quad-Site 32 pin plus 25 grounds socket for strip testing. This socket is designed for testing packages prior to sawing apart. An alignment plate is provided for setup using a dual-latch lid. The lid has individual spring loaded pressure plates. A backing plate was provided for the back side of the DUT board. High pin force test pins were used for lead free packages.

    Sockets are available for all pin counts and for lead free and leaded packages.

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    Designed for FA customers which require a very low profile socket for QFP (PQFP, LQFP, etc) or SOIC packages, Robson offers the 900-1149 Ultra Low Profile Open Top FA Sockets. The top of the socket lid is the same height or lower than the top of the package. This is ideal for micro-probing, or a very short focal length lens. These are available in 0.4, 0.5, 0.65, 0.8, 1.0 and 1.27 pitches. .

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    DUT BOARDS     BACK TO THE TOP

    RTI designs and manufactures DUT boards for many types of special purpose test equipment including: ESD test systems, special purpose functional testers, automated curve trace equipment, as well as standard semiconductor test equipment. All designs are performed in-house using PCB design software (Mentor PADS, CAM350) and 3D mechanical design software (Solid Edge) if required. PCB fabrication is sub-contracted to one of our long time fabrication partners. All boards have a 100% opens and shorts test before assembly. All final assembly and final test is performed in-house.

    Design features of the DUT boards can include:

  • Multi-layer (up to 32 layers)
  • Controlled impedance
  • Equal line lengths
  • Programming matrix for power and grounds
  • Active and passive components
  • Mechanical interfaces (docking plates, etc)
  • Active switching matrix for increasing pin counts
  • Pogo Pin interfaces
  • Daughter- Mother board configurations
  • Gold and platinum plating
    • DUT BOARDS
    Product Photo Gallery
      DUT board for a ThermoKeyTec MK2 system with an RTI universal 1024 BGA socket. These sockets and DUT boards are available for 0.5, 0.8, 1.0 and 1.27mm pitch packages.
      DUT board for a ThermoKeyTec verifier system.
      RTI custom CMOS imaging device socket and DUT board for a KVD test system.
      Custom DUT board for a BGA device with passive components.
      RTI universal pogo pin interface board for HiLevel test systems. Daughter cards are available for up to 160 signal pins. Handles are mounted on the DUT board for easy removal from the test system.
      This system allows the HiLevel test system to be used for testing under a probe station, in a black box, EMI, and other remote locations from the HiLevel. All 512 channels are available from the Hilevel test system. The interface between the Hilevel test system and the daughter card fixture is through controlled impedance ribbon cable and pogo pin connectors. The daughter card fixture is designed to set on a wafer chuck for probing or upside down on an EMI system. Daughter cards (DUT boards) are 6.5 x 8.0 inches. The daughter cards interface directly to the pogo pin cables. Loop-back boards are available for system set-up and test. The HiLevel interface DUT board plugs directly into the Hilevel. Handles on the DUT board make removal easy.

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    TEST FIXTURES    BACK TO THE TOP

    RTI specializes in providing test fixtures for unique semiconductor and hybrid packages. Our fixtures typically include a custom designed socket and a custom PCB for interfacing to customer supplied test equipment. RTI can provide fixtures featuring many custom requirements such as: active electronics, specialized mechanical interfaces, pneumatic placement, multi-cavity sockets, and multi-position fixtures with active switching circuitry.

    RTI is experienced in designing test fixtures for the following applications:

  • Liquid crystal testing
  • Dual sided test of hybrids
  • Hearing aids
  • Multi-chip hybrids and modules
  • Medical implant hybrids
  • Optical packages
  • CMOS imaging devices
  • Flex circuits
  • Small PCBs
  • Products for aerospace
  • RF modules
  • Custom switch boxes for curve trace
    • TEST FIXTURES
    Product Photo Gallery
      Socket and fixture for testing a ceramic hybrid module and flex circuit for a space satellite. Test points on the ceramic are randomly placed on a pitch as small as 0.5mm.
      This system allows the HiLevel test system to be used for testing under a probe station, in a black box, EMI, and other remote locations from the HiLevel. All 512 channels are available from the Hilevel test system. The interface between the Hilevel test system and the daughter card fixture is through controlled impedance ribbon cable and pogo pin connectors. The daughter card fixture is designed to set on a wafer chuck for probing or upside down on an EMI system. Daughter cards (DUT boards) are 6.5 x 8.0 inches. The daughter cards interface directly to the pogo pin cables. Loop-back boards are available for system set up and test. The HiLevel interface DUT board plugs directly into the Hilevel. Handles on the DUT board make removal easy.
      This pneumatic assisted fixture was designed for production test of a long narrow PCB used in musical amplifiers.
      This production test fixture included a switch matrix and a custom test socket for a 32 BGA device.
      RTI designed and manufactured 50 of these test systems for a hand-held communications device. Contact to the unit under test was made through pogo pins which went through small holes in the plastic base. The test box contained active electronics to interface to the customers test equipment.
      This customer required that a test socket be mounted to an existing PCB with no existing mounting holes. RTI designed a surface mount socket for the MCM and a clamp to hold the socket on the PCB while still allowing access to all the required connectors on the PCB.
      This ten-up fixture was designed to test medical hybrids. Test pads were located on both the top and bottom of the ceramic hybrid. Multicolor LEDs indicate which hybrid was being tested and the status of each unit ( good, bad, under test, not tested).
      Test socket for a silicon-on-flex circuit with probes on 0.5mm centers. Socket was also designed with a through-hole adaptor with active electronics and mating socket receptacle.
      10-up test socket and test system for high speed optical interface modules. The test system tested 10 units in parallel. The test box was microprocessor controlled and tested for opens and shorts between all pins.
      This fixture is designed for back side test of a 117 BGA package. RTI can supply fixtures for back side test of most package types.
      This fixture was design to perform liquid crystal analysis at the wafer level using a probe station and a hot chuck. The fixture includes a pogo ring interface to the probe cards, custom probe cards, and interface to 34 pin headers as will as all the mechanical interfaces.

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    COMPLETE INTERFACE SOLUTIONS     BACK TO THE TOP

    RTI has developed many complete interface solutions, including everything required to interface to third party test systems. These solutions are semi-custom, meaning we can modify any of them to meet your specific requirements. In most cases these solutions interface to RTI's standard daughter cards and sockets. We are adding new solutions every month, so please call to see if we have already designed an interface solution for your specific requirement.

    Some examples of interface solutions we have designed include:

     

    		   This system allows the HILEVEL test system to be used for testing under a probe station, in a black box, EMI, and other remote locations from the HILEVEL. All 512 channels are available from the HILEVEL test system. The interface between the HILEVEL test system and the daughter card fixture is through controlled impedance ribbon cable and pogo pin connectors. The daughter card fixture is designed to sit on a wafer chuck for probing or upside down on an EMI system. Daughter cards (DUT boards) are 6.5 x 8.0 inches. The daughter cards interface directly to the pogo pin cables. Loop-back boards are available for system set up and test. The HILEVEL interface DUT board plugs directly into the HILEVEL test system. The handles on the DUT board make removal from the test system easier.
      Universal QFN Fixtures for topside and backside testing including ability to:
    • Micro probe topside
    • Heat the package for liquid crystal testing using RTI's temperature controller
    • Backside test
    • Heated backside test using RTI's heated lid and temperature controller
    • Heated and cooled top and backside test using a hot / cold wafer chuck
    Other features of this system include:
    • Pogo pin interface to the daughter cards
    • The same socket and mini card can be used for all applications
    • Four lid styles available
    • Universal pogo pin interface fixtures
    • Standard 100 pin Yamaichi interface cable

    		  This is one of several RTI standard interfaces to UTI's curve trace system using the UTI 25 x 25 ZIF PGA interface (an extended handle on the ZIF socket may be required). The interface shown can either interface to four 96 channel ribbon cables using Yamaichi 100 pin connectors, or directly to RTI's 96 daughter card also shown. RTI has several 34 pin header interfaces (32 channels per header) for the UTI system.


    		  Liquid Crystal Analysis Systems: RTI has built hundreds of different fixtures for liquid crystal analysis. Systems include heated sockets, daughter boards, mother boards, interface cables, temperature controllers, and mechanical interfaces for mounting the fixtures to probe stations and other test equipment. RTI has solutions for fully populated BGA devices, fine pitch devices, as well as most standard packages.
      The RTI-950-1001-FB200-IF-05 interface fixture is designed to interface with the NSC 200 curve Tracer FX * series. The fixture is designed to accept RTI's 950-96MC and 950-196 series daughter cards. A large selection of standard daughter cards is available to meet almost every FA and socket requirement. RTI can also provide custom daughter cards as well as custom interfaces to the FB200.

    The FB200 is a low cost curve trace system manufactured by NSC

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    Switch Boxes & A/B Relay Boxes     BACK TO THE TOP

    Manual switch boxes are used for curve trace and other FA and engineering requirements. RTI has two standard switch boxes, an expandable 32 channel switch box and a 96 channel switch box. Our switch boxes use PCB technology and high performance sealed instrument rated switches. No discrete wiring is used.

    Product Photo Gallery
      RTI's standard 96 channel switch box with interface to either 34 pin headers or Yamaichi 100 pin connector. All PCB technology with no discrete wiring is used in the design. High performance instrument type sealed switches are used for long life and reliability.
      RTI’s standard 32 channel expandable switch boxes. The boxes can be “plugged” together for expansion to as many channels as required. All PCB technology with no discrete wiring is used in the design. High performance instrument type sealed switches are used for long life and reliability.
      A 96 channel relay box to switch between two devices under test. Shown plugged into the 96 pin switch box, but can be used stand alone. Uses 100 pin Yamaichi connectors.NSC

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    OTHER PRODUCTS    BACK TO THE TOP

    High Speed Pogo Pin Cables

    RTI designs and manufactures several configurations of interface cables for high performance test requirements. The 50 ohm controlled impedance cables use coaxial ribbon cables and gold-plated controlled-impedance PCB’s. Connection to the test equipment is made though pogo pin blocks. The pogo pin blocks can be easily replaced as well as individual pogo pins.

    Custom Socket Receptacles

    RTI designs and manufactures socket receptacles for custom sockets as well as for the RTI-Plastronics Sockets. High quality gold-plated machined pins are used. Plastics included Ultem 1000 and other high performance plastics.

    Test Probes

    RTI uses test probes designed specifically to meet our high quality and performance specifications. The probes are manufactured in both the US and off-shore locations. Our probes are selected to best meet specific requirements such as high force for lead-free and low inductance for RF testing.

    Socket Adaptors

    RTI designs socket adaptors to adapt most surface mount and through-hole sockets to PGA or other custom pin patterns. These can then be used in zero-insertion-force PGA sockets that many test systems use, including UTI’s curve trace systems and RTI’s DUT boards and mother/daughter boards.

    		RTI socket and adaptor board to adapt a 108BGA 0.5mm pitch package to a 17 x 17 PGA.
    		An adaptor using a standard BGA burn-in “push down” socket interfacing to a PGA.

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    BRIDGE Technology is an authorized representative of Robson Technologies, Inc.

    For service please contact Bridge Technology at (480) 988-2256 or send e-mail to Larry Bridge at: sales@bridgetec.com.

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