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ULTRACOLLIMATOR modules provide the ability for
producing extremely parallel surfaces on our range polishing
products.
The system allows for sub-micron parallelism to
be attained on the topside of an electronic die being de-processed or
backside polished, or for use in aligning the sides of a wafer being
processed, to be parallel.
System Specifications
|
Order Code |
Description |
| 6183.A |
ULTRACOLLIMATOR Module-
Optical Parallelism alignment system - for use on ASAP-1.
Module includes camera (mounted into
ASAP-1 base unit), optical alignment flat, machine vision moule, lcd
display |
| 6183.M |
ULTRACOLLIMATOR Module -
Optical Parallelism alignment system - for use on MULTIPOL.
Module includes camera, stand with roller
bar assembly, optical alignment flat, lcd display
|
| 6642.1 |
Video
Caliper, dual axis |
| 6443.1 |
External Monitor - 13 inch
(NTSC) |
| 6245.1 |
NTSC to PAL
Converter |
>> Patent
Pending
|
>> See Schematic of ULTRACOLLIMATOR
Modes of Use
>> Download ULTRACOLLIMATOR
Datasheet
>> Download TEC Note# 6 - "Improved
de-processing of multi-layer electronic devices with optical alignment
techniques"
Image above shows the 6183.M showing the
reflected image of the wafer's backside surface
Image above shows the 6183.A module in position
on ASAP-1 The ASAP-1 module also incorporates a machine-vision
module.
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