The systems offer motorized Y travel, along with built-in X and ‘Z-spindle’ stages. This makes ‘set-ups’ very rapid and convenient to perform. The saws’ unique ability to process thin and thick samples make them highly versatile and capable of slicing or wafering with the addition of ULTRA TEC’s "quick release" workholder range.

Applications that have benefited from the ULTRADICE approach include the dicing of silicon, microwave materials and components (based on GaAS, INP etc), MEMS, optical prisms, fiber arrays, scintillator materials (BGO and related materials), metals, alumina ceramics, single crystals, medical devices, PZT and thin glass plates.

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Features & Benefits:

• 6-inch (152mm) & 4-inch (101mm) models available
• X, Y and Z Stages standard
• Dicing and slicing possible on a single machine
• Cut thin & thick wafers and sheets
• For most components and materials
• Variable blade speed up to 10,000 rpm
• Vacuum Chuck option
• Microscope Option
• Unattended operation
• All Blade Types accepted – optimize longevity
• Affordable for all production levels (research, start-ups and production plants)