The ability to produce accurate, reproducible, thinned dice for backside analysis is now available for every laboratory. Flip-chip and power chip mechanical decp is now straightforward and accurate.

Thinned and polished die in a PQFP package, imaged using  an Emission Microscope with NIR Illumination, with 20X objective.  Image courtesy of CONEXANT

The die, whether in packaged or wafer form, is mounted on a specially designed traveling table oscillates within X and Y direction limits set by the user.

Utilizing a rotating tool, controlled in the Z-Direction, accurate, reproducible back-grinding can be carried out to a specific thickness (routinely to less than 50mm of remaining silicon), finishing with a scratch-free mirror polish. This yields a surface ready for imaging and backside microscopy.

By changing tools, in conjunction with loose or fixed abrasives, a scratch-free surface is produced. Heating of the substrate is minimal during processing due to the extreme low damage nature of the process. The process also improves yields.

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