ProbeLogic PROBE CARDS

ProbeLogic is the premier probe card and PCB design specialist in the semiconductor industry. ProbeLogic utilizes state-of-the-art technology and equipment to ensure quicker turn-times, lower cost, and higher quality products. It is this commitment to our customers that sets us apart from other companies in the industry. We will show you how technology and customer care become one at ProbeLogic.

Cantilever Probe Cards
ProbeLogic has developed ways to advance the manufacturability and increase the performance of the cantilever probe card which has proven to be the most durable, highest quality probe card on the market. By utilizing internally developed manufacturing processes, ProbeLogic is able to provide test solutions for either single row or staggered die pad configuration and high density devices. In addition to our proprietary manufacturing processes and build equipment, we use 3-D modeling and numerical analysis design software to evaluate each and every design. This combination allows us to reduce lead times to our customers and provide a service to them that no other company can match.
Benefits of the Cantilever Probe Card
  • 3-D Modeling and numerical analysis provides higher performance and accuracy
  • Our state-of-the-art equipment produces fast turn times
  • Higher temperature option at no additional cost (up to 120ºC)
  • Durable and easy to repair
  • Each card is developed based on customized specifications


    • Fine Pitch Probe Cards
    Test solutions for ICs with denser architecture, smaller bond pads, reduced pad pitch, and new low-k materials.
    Our customers are continuing to create ICs with denser architecture, smaller bond pads, reduced pad pitch, underlying circuitry, and new low-K materials, for which ProbeLogic has a solution. In addition to our standard Cantilever probe cards that can probe bond pad pitches down to 60 microns, we have developed our Fine Pitch/Low-k probe card for bond pad pitches down to 30 microns. We have been able to take the once difficult and impossible dilemma of testing today's complex ICs and made it possible for our customers. With our far superior 3-D modeling, FEA Analysis, proprietary build equipment, manufacturing process, and use of quality probe needles, we are able to provide a solution that is robust, decreases scrub marks, provides superior contact, and is reliable at higher test temperatures. Benefits of the Fine Pitch Probe Card
  • Higher pin counts for applications with dense architecture
  • Ability to probe low-k and underlying pad circuitry
  • Higher test temperatures will not effect probe card (up to 165ºC)
  • Uniform scrub marks


    • Multi-DUT Diagonal Cantilever Probe Cards
    Test solutions for customers who require increased throughput and decreased test time
    As the need to reduce test time and increase throughput becomes more and more of an issue for our customers, ProbeLogic has again come forward with a solution. Our Multi-DUT cantilever probe card achieves all of the goals our customers have asked of us. With the Multi-DUT probe card, we are able to test up to 60 devices at a time. In striving to offer superior customer service, we are willing to review any device to determine what can be done to increase throughput and decrease test time using ProbeLogic's Multi-DUT probe card technology. Benefits of the Multi-DUT Probe Card
  • Simultaneously test up to 60 Dies/DUTs
  • Contact force, contact resistance, and scrub marks are consistent for each Die/DUT
  • Each card is custom built to probe and pattern specification
  • Testing temperatures up to 165ºC






    • Vert!™ Vertical Probe Cards
    As the flip chip market permeates into IC testing, technologies to probe these new devices must also evolve. Vert!™ is a non-wired vertical probe card that is designed and fabricated with the customer in mind. The Vert!™ technology allows ProbeLogic the ability to provide a single solution with all the advantages semiconductor companies see in multiple vendors now.
    Overview
    ProbeLogic has developed an unique approach to probing area array solder bump devices. Superior probe contacts and a “no-float” approach provide exact contact force delivery and electrical characteristics between the bump and the probe card. Engineering a design that is based on two components, the space transformer and probe head, Vert!™ is fast becoming the choice in vertical probe cards. ProbeLogic engineers designed these two components to be modular and swappable for any given device (refer to the ProbeLogic apps note on probe head installation and removal). The custom designed hardware and probe head are engineered so that there is no need for exercising, fine alignment or planarity adjustments, as seen with other vertical technologies.
    Space Transformer
    Utilizing the customers substrate/package for the Space Transformer, the substrate is re-flowed onto the tester PCB, resulting in a 50 ohm electrical path from tester to probe, thereby eliminating cross-talk, capacitance, and inductance issues typical of Wired Space Technology.

    BRIDGE Technology is an authorized representative of ProbeLogic

    To request further information please call Bridge Technology at (480) 988-2256 or send e-mail to Larry Bridge at: sales@bridgetec.com

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